MIL-STD-833 Product Testing

With over 70 years of component and product testing experience, Tektronix has the knowledge and standards to meet your MIL-STD-883 testing needs.

The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within defense and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations.

We are DSCC suitable for many of the following methods:

Method Number / Environmental Tests

1001
1002
1003
1004.7
1005.8
1006
1007
1008.2
1009.8
1010.8
1011.9
1012.1
1013
1014.12
1015.9
1016.1
1017.2
1018.5
1019.7
1020.1
1021.2
1022
1023.2
1030.2
1031
1032.1
1033
1034.1
Barometric pressure, reduced (altitude operation)
Immersion
Insulation resistance
Moisture resistance
Steady state life
Intermittent life
Agree life
Stabilization bake
Salt atmosphere (corrosion)
Temperature cycling
Thermal shock
Thermal characteristics
Dew point
Seal
Burn-in test
Life/reliability characterization tests
Neutron irradiation
Internal gas analysis
Ionizing radiation (total dose) test procedure
Dose rate induced latchup test procedure
Dose rate upset testing of digital microcircuits
Mosfet threshold voltage
Dose rate response of linear microcircuits
Preseal burn-in
Thin film corrosion test
Package induced soft error test procedure (due to alpha articles)
Endurance life test
Die penetrant test (for plastic devices)

Mechanical Tests

2001.2
2002.4
2003.8
2004.5
2005.2
2006.1
2007.3
2008.1
2009.9
2010.11
2011.7
2012.7
2013.1
2014
2015.13
2016
2017.8
2018.4
2019.7
2020.8
2021.3
2022.2
2023.5
2024.2
2025.4
2026
2027.2
2028.4
2029
2030
2031.1
2032.2
2035
2036
Constant acceleration
Mechanical shock
Solderability
Lead integrity
Vibration fatigue
Vibration noise
Vibration, variable frequency
Visual and mechanical
External visual
Internal visual (monolithic)
Bond strength (destructive bond pull test)
Radiography
Internal visual inspection for DPA
Internal visual and mechanical
Resistance to solvents
Physical dimensions
Internal visual (hybrid)
Scanning electron microscope (SEM) inspection of metallization
Die shear strength
Particle impact noise detection test
Glassivation layer integrity
Wetting balance solderability
Nondestructive bond pull
Lid torque for glass-frit-sealed packages
Adhesion of lead finish
Random vibration
Substrate attach strength
Pin grid package destructive lead pull test
Ceramic chip carrier bond strength
Ultrasonic inspection of die attach
Flip chip pull-off test
Visual inspection of passive elements
Ultrasonic inspection of TAB bonds
Resistance to soldering heat

 

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